Method and device for electrostatic discharge protection

ABSTRACT

A device for providing electrostatic discharge (ESD) protection is provided. The device includes a semiconductor substrate having a drain, a source, and a gate formed therein. The drain contains a region having a resistance that is higher than the resistance of the remainder of the drain and the source. The gate region is in contact with this higher resistance region and the source. In one embodiment, the higher resistance is lacking silicide in order to provide the higher resistance. A method of forming a device for providing ESD protection is included.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 10/956,758 filed on Sep. 30, 2004 now U.S. Pat. No. 7,671,416,and entitled, “METHOD AND DEVICE FOR ELECTROSTATIC DISCHARGEPROTECTION.” The disclosure of this related application is incorporatedherein by reference for all purposes.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to electrostatic discharge (ESD)protection in semiconductor devices, and in particular to providing ESDprotection to input output devices by having current uniformity in theinput output devices.

2. Description of the Related Art

ESD is the rapid, spontaneous transfer of electrostatic charge thatoccurs between bodies at different electrostatic potential and may beinduced by direct contact or by an electrostatic field. ESD causes highcurrent flow in electronic components. The high current flow can damagethe electronic components. Also, the heat dissipated during ESD can behigh and the corresponding high temperature can damage the electroniccomponents. As a result, ESD protection has become a major focus for theelectronic industry.

FIG. 1 is a simplified schematic diagram illustrating a transistorhaving a conventional ESD protection scheme. The transistor includes adrain 100, a gate 102, and a source 104. The transistor further includespoly-resistors 110 on the side of the drain 100 and the source 104. TheESD current flow is spread among the poly-resistors 110 so that theeffect of the current will be divided among the numerous poly-resistors110. In this manner, the intensity of the current flow to any particularpoly-resistor 110 will be diminished, thereby preventing damage to thedevice. One of the shortcomings with this approach is that a silicidefilm is used for the resistors and the transistors for reducing theresistance of the drain, source, and gate regions. The narrow width ofthe silicide film leads to uneven distribution of its resistance profileand impacts the uniformity of the current flow. As the current will takethe path of least resistance, the current will go through poly-resistorshaving the least resistance, caused by the uneven distribution of thesilicide film, thus generating hot-spots where damage can occur. Also,the lower resistance caused by the silicide in the poly-resistor mayenable the current due to ESD to flow to the gate region. Accordingly,there exists a high probability that the gate region will be damaged bythe current from the ESD resulting in a damaged semiconductor device.Additionally, on the source side, the poly-resistors 110 cause a voltagedrop in the source region. This voltage drop raises the sourcepotential. In turn, the raised potential impedes the turn-on of thesubstrate, thereby making it hard to turn on the diode between thesource and the substrate, which makes it more difficult to turn on thetransistor.

In view of the foregoing, there is a need for semiconductor devices thatcan uniformly spread an ESD current, and further, there is a need fortransistors that can be more easily turned on.

SUMMARY OF THE INVENTION

Broadly speaking, the present invention fills these needs by providing adevice and method for electrostatic discharge (ESD) protection insemiconductor devices. The embodiments of the present invention providea sub-region of a high resistance in the drain. The sub-region in thedrain is placed in close contact with the gate so that the resistancenear the gate is higher compared to the other proximate regions. Thishigher resistance helps to direct the current due to ESD away from thegate, since the current takes the path of least resistance. Theinvention essentially forces the current to uniformly pass through thesubstrate instead of to the gate. The present invention may beimplemented in numerous ways, including a device and a method forforming a device. Several embodiments of the present invention aredescribed below.

In one aspect of the invention, a device for providing electrostaticdischarge (ESD) protection is provided. The device includes asemiconductor substrate having a drain, a source, and a gate formedtherein. The drain contains a region having a resistance that is higherthan the resistance of the remainder of the drain and the source. Thegate region is in contact with or proximate to this higher resistanceregion. The gate is also in contact with the source. In one embodiment,the higher resistance region is lacking silicide (silicide-free) inorder to provide the higher resistance. In another embodiment, thedevice includes a poly resistor that is coupled to the drain through ametal contact. The poly resistor is composed of elements that provideadded resistance to the path of the ESD current, in order to prevent theESD current from reaching the gate region.

In another embodiment of the invention, a method of forming a device forproviding electrostatic discharge (ESD) protection is provided. Themethod includes forming a source region, drain region, and gate regionon a semiconductor substrate. A region in the drain having a firstresistance is then formed. The region in the drain is maintained at ahigher resistance than the remainder of the drain region so that thecurrent due to ESD may be blocked by the region in the drain.

Other aspects and advantages of the invention will become apparent fromthe following detailed description, taken in conjunction with theaccompanying drawings, illustrating by way of example the principles ofthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be readily understood by the followingdetailed description in conjunction with the accompanying drawings, andlike reference numerals designate like structural elements.

FIG. 1 is a simplified schematic diagram illustrating a transistorhaving Electrostatic Discharge (ESD) protection.

FIG. 2A illustrates an ESD protection circuit in accordance with anembodiment of the present invention

FIG. 2B is a simplified top view of the ESD protection circuitillustrated in FIG. 2A.

FIG. 3A, illustrates an ESD protection circuit utilizing poly-resistorsin accordance with one embodiment of the invention.

FIG. 3B is a simplified top view of the ESD protection circuitillustrated in FIG. 3A.

FIG. 4 is an alternative embodiment of an ESD protection circuit inaccordance with an embodiment of the present invention.

FIGS. 5A-5H illustrate a scheme for fabricating the ESD protectioncircuit in accordance with an embodiment of the invention.

FIG. 6 is a flow chart illustrating the method of operations involved informing a device having an ESD protection in accordance with anembodiment of the invention.

DETAILED DESCRIPTION

An invention for electrostatic discharge (ESD) protection insemiconductor devices is provided. The embodiments of the presentinvention include a sub-region in the drain having a high resistancecompared to the rest of the region in the drain. The sub-region in thedrain is placed in close contact with the gate region so that theresistance of the current path increases from the drain to the gateregion. Accordingly, the current due to ESD will avoid taking the pathfrom the drain to the gate region and will take another path having alower resistance. In the following description, numerous specificdetails are set forth in order to provide a thorough understanding ofthe present invention. It will be apparent, however, to one skilled inthe art that the present invention may be practiced without some or allof these specific details.

FIG. 2A shows an ESD protection circuit in accordance with an embodimentof the present invention. The ESD protection circuit includes a P-typesubstrate 202. A plurality of n-type diffusion regions 204, and 206 areformed on the p-type substrate 202. The n-type diffusion regions 204 and206 form the drain and source, respectively, of an NMOS transistor. Agate 208 is formed in the region between the drain and the source. Thegate 208 includes an oxide layer 215 and a poly-silicon layer 216disposed over the oxide layer. Together, the drain, the gate 208 and thesource make up an NMOS transistor. A sub-region of high resistance 214is formed in the drain, in a region that lies immediately adjacent togate oxide 215 of the gate 208. In one embodiment, the sub-region ofhigh resistance 214 is in contact with the region under the gate 208,i.e., gate oxide 215. In another embodiment, the sub-region of highresistance is formed at a distance of about 0.1 μm to about 5.0 μm fromthe gate.

According to this embodiment, a plurality of contacts 210 and 212 areformed on the drain and source, respectively. The contacts 210 and 212are conductors and are preferably composed of metal. However, thecontacts can be composed of any suitable material that conductselectricity. In one embodiment, the distance between the contact 210 andthe gate 208 is in the range of about 0.5-2.0 micron for a 90 nm die.The drain contains a diffusion region 220 and a sub-region of highresistance 214. The present invention utilizes the resistance of thediffusion region 220, and the sub-region of high resistance 214 tospread the current uniformly. The resistance of the diffusion region 220is represented by the resistor symbol 218. In one embodiment, the higherresistance for the sub-region 214, relative to the diffusion region 220,is produced by avoiding silicide formation in the sub-region. Theprocess involved in forming the sub-region of high resistance 214 isdescribed in detail below with reference to FIGS. 5A-5H.

By blocking silicide formation in the sub-region of high resistance 214,as described in more detail below, the resistivity of the sub-region ofhigh resistance, can be increased at least by one order of magnitude.With the embodiment described herein, when an ESD occurs, the currentdue to the ESD takes on the path indicated by the arrow 222 in FIG. 2A.The high resistance near the gate due to the sub-region of highresistance 214 forces the current to go down to the silicon bulk of thep-substrate 202. The source includes the silicide film, which helps toreduce the resistance on the source side. It should be appreciated thatthe lower resistance of the source allows for an easier turn-on of theparasitic bipolar transistor. It should be appreciated that the width ofthe sub-region of high resistance 214 can be varied depending on theresistance required. In one embodiment, the width ranges from about 0.1μm to about 5.0 μm.

FIG. 2B shows a top view of the ESD protection circuit illustrated inFIG. 2A in accordance with an embodiment of the invention. FIG. 2B showsthe sub-region of high resistance 214 overlapping the gate 208. Thediffusion region 220 has a resistance that is represented by thediffusion resistor symbol 218. The use of the resistance of thediffusion region 220 in conjunction with the sub-region of highresistance 214, helps to save real estate space on the die by avoidingthe requirement of the additional poly-resistors. Moreover, the use ofthe resistance of the diffusion region 220 helps to spread the currentuniformly over the diffusion region 220, thereby reducing the impact ofan ESD on any specific region. FIG. 2B further includes alternating finresistors 224 connected to the drain 204. The fin resistor resistance isrepresented by the fin resistor symbol 225. As shown, fin resistors 224are connected to certain areas in the diffusion region 220 and not toother areas. This connection scheme is configured to provide sufficientresistance to spread out the ESD current. In order to enhance spreadingof the current due to an ESD in the drain, the diffusion regions thatare not connected to the fin resistors 224 are constructed withoutsilicide, in one embodiment. As described earlier, the resistance of thesource 206 is maintained low relative to the drain, which helps to keepthe source 206 at ground potential, in order to facilitate an easierturn-on of the parasitic bipolar transistor. As such, diffusionresistors and other types of resistors that might increase theresistance of the source 206, are avoided in the region that is in closeproximity with the source 206. Although FIGS. 2A and 2B illustrate anNMOS transistor, it is understood and appreciated that the embodimentsdescribed herein are applicable to other types of transistors such asPMOS transistors.

Another embodiment is presented in FIG. 3A, illustrating an ESDprotection circuit utilizing poly-resistors in place of the diffusionresistors in the drain region. In FIG. 3A, a plurality of n-typediffusion regions 304, and 306 are formed on the p-type substrate 302.The n-type diffusion regions 304 and 306 form the drain and source,respectively, of an NMOS transistor. A gate 308 is formed in the regionbetween the drain 304 and the source 306. The gate 308 includes an oxidelayer 315 and a poly-silicon layer 316, disposed over the oxide layer315. Together, the drain 304, the gate 308 and the source 306 make up anNMOS transistor. A sub-region of high resistance 314 is formed in thedrain 304. In one embodiment, the sub-region of high resistance 314 isadjacent to an edge of the gate 308. In another embodiment, thesub-region of high resistance 314 is in contact with a bottom surface ofthe gate 308, i.e., the sub-region of high resistance is defined under aportion of the bottom surface of the gate. In yet another embodiment,the sub-region of high resistance 314 is not in contact with the gateoxide 315 of the gate 308, i.e., there is a gap between the two. Wherethere exists a gap between the two, the distance between the gate 308and the region of high resistance 314 is between about 0.1 μm to about5.0 μm.

The drain 304 is connected to a poly-resistor 318 via metal connect 319.The poly resistor 318 has a higher resistance relative to the drain. Inone embodiment, the high resistance is caused by the poly-resistor 318having no silicide. Shallow trench isolation 330 (STI) is used toseparate the poly-resistor 318 from the p-substrate 302. This way, whenan ESD occurs, the current passes through the poly resistor 318 and themetal contact 319 into the drain region 304. The current due to the ESDis then directed to the silicon substrate 302, as indicated by arrow321. The damaging effect of the current due to the ESD, on thep-substrate 302, is blocked through the poly-resistor 318 and the STI330. Furthermore, the sub-region of high resistance 314 prevents thecurrent from flowing to the gate 308 from the drain 304, thus protectingthe device from being damaged due to the ESD.

FIG. 3B is a simplified top view of the ESD protection circuitillustrated in FIG. 3A in accordance with an embodiment of theinvention. FIG. 3B shows the poly resistor 318 connected to the drain304. FIG. 3B also shows fin resistors 324 connected to the drain 304.The drain 304 includes a sub-region of high resistance 314. Thepoly-resistor 318, together with the sub-region of high resistance 314,directs the current from an ESD into the silicon substrate 302 and awayfrom the gate 308.

FIG. 4 is an alternative embodiment of the ESD protection circuit inaccordance with an embodiment of the present invention. The embodimentsillustrated in FIGS. 2A and 3A generally provide ESD protection due to apositive charge. FIG. 4 shows an ESD protection circuit 402 connected inparallel with a diode 404. The ESD protection circuit 402 is of the kinddescribed in FIGS. 2A and 3A. That is, a sub-region of high resistanceis included with or without poly-resistors as illustrated in FIGS.2A-3B. Due to the added resistance on the drain side, in the ESDprotection circuit described above, the substrate diode between thedrain and the substrate cannot effectively conduct the ESD currentduring a negative ESD occurrence. Therefore, a separate diode 404 isadded as shown in FIG. 4. When a negative ESD occurs, the current isdirected to an input/output node 410 from ground 406 through the diode404 as indicated by arrow 408.

FIGS. 5A-5H illustrate a scheme for fabricating the ESD protectioncircuit described above in accordance with an embodiment of theinvention. Initially a silicon substrate 202 is provided. Next, a p-well(not shown) is formed in the substrate 202 by methods such as boronimplant or through any other known semiconductor process. Alternately, ap-silicon substrate may be used as shown in FIG. 5A. Then, in FIG. 5B aplurality of n diffusion regions are formed in the p-silicon substrate202. The n diffusion regions form the drain 204 and source 206,respectively, of an NMOS transistor. One skilled in the art willappreciate that known semiconductor processing techniques may be usedfor forming the n diffusion regions. Thereafter, a gate 208 defined bypoly-silicon layer 216, disposed over gate oxide layer 215, is formedover the silicon substrate 202 between the drain 204 and the source 206.

In one embodiment, the gate is formed by first depositing an oxide layer215 on top of the silicon substrate 202, followed by depositing apoly-silicon layer 216 upon the oxide layer 215 as illustrated in FIGS.5C and 5D. Masking and etching steps are used to define the gate 208shown in FIG. 5E. Together, the drain 204, the gate 208, and the source206 make up an NMOS transistor. Then, as shown in FIG. 5F, a mask 250 isdeposited in the drain region over a portion of the drain 204 next tothe gate 208, without overlapping the gate. In one embodiment, the maskmay overlap the gate 208. Any suitable photoresist may be applied anddeveloped to form mask 250. In FIG. 5G a refractory metal layer, such ascobalt (Co) is deposited over the drain 204, the source region 206, andthe gate 208. The deposited layer is thermo-cycled to form the silicidematerial, e.g., cobalt silicide (CoSi₂). In one embodiment, theimplanted cobalt is followed by a rapid thermal annealing to form CoSi₂in part of the drain, in the source region, and in the gate.Subsequently, the mask 250 may be removed by etching or through othermeans as shown in FIG. 5H. As can be seen, in FIG. 5H, a sub-region ofhigh resistance 214 is formed in the drain region next to the gate 208.Regions 253 a, 253 b, and 253 c have low resistance as regions 253 a,253 b, and 253 c contain silicide. As described in detail above withrespect to FIGS. 2A and 3A, the sub-region of high resistance 214protects the semiconductor device by blocking the path of the currentdue to an ESD from reaching the gate 208.

Silicide formation, as described above, typically requires a refractorymetal to be deposited on the silicon wafer. Thereafter, a hightemperature thermal anneal process produces the silicide material bycausing the refractory metal to react with the silicon. As used herein,a silicide is a metal compound that is thermally stable and provides forlow electrical resistivity at the silicon refractory metal interface.One skilled in the art will appreciate that titanium, cobalt, and nickelare common refractory metals used for contacts in aluminum interconnecttechnologies. Copper interconnect technologies typically use cobalt ornickel metals to form silicides. Table 1 illustrates exemplary silicidesand their corresponding resistivity.

TABLE 1 Silicide Resistivity (μΩ/cm) Cobalt/Silicon (CoSi₂) 13-19Molybdenum/Silicon (MoSi₂) 40-70 Platinum/Silicon (PtSi) 28-35Titanium/Silicon(TiSi₂) 13-17 Tantalum/Silicon (TaSi₂) 35-55Tungsten/Silicon (Wsi₂) 24-31

FIG. 6 is a flow chart illustrating the method of operations involved inmaking an ESD protection circuit in accordance with an embodiment of theinvention. The method initiates with providing a semiconductor substrateas shown in operation 602. The substrate may be of p-type or n-type.Then, in operation 604, a source, a drain, and a gate are formed in thesemiconductor substrate. The source, drain, and gate may be formed usingany of the standard semiconductor processing procedures, e.g., thetechniques discussed with reference to FIGS. 5A-5H may be employed. Asdescribed above, the source, drain, and gate together form a transistorof n or p type. Next, in operation 606, a first region is formed in thedrain. The first region, which may be referred to as a drain sub-regionor sub-region of high resistance, is associated with a first resistance.The remainder of the drain has a second resistance wherein, the firstresistance is higher than the second resistance. In one embodiment, thefirst resistance is at least an order of magnitude greater than thesecond resistance. The first region is in close proximity, adjacent to,or overlapping with the gate so that an ESD current is prevented fromreaching the gate. As described above, the first region may be formed byavoiding, or preventing, silicide formation within the first region,i.e., the first region is silicide-free. Thus, in one embodiment, thefirst region has a resistance that is an order of magnitude greater thanthe resistances listed in Table 1, where the values listed in Table 1are representative of the resistance of the remainder of the drainregion, i.e., the second resistance. In one embodiment, the remainder ofthe drain region may have silicide incorporated therein to maintain alower resistance in the second region as compared to the first region.The source resistance is maintained lower than the first resistance asindicated in operation 608, so that the parasitic bipolar transistor canbe turned-on easily. In one embodiment, the source resistance ismaintained lower by incorporating silicide therein, as illustrated withreference to FIGS. 5A-5H.

The embodiments thus far were described with respect to ESD protectiondevices. It is understood and the appreciated that the device describedherein may be used to provide protection from other incidents. Forexample, problems that are caused when input/output power supplies aretriggered may be alleviated through the above-described embodiments. TheESD protection device described herein may be incorporated into anysuitable integrated circuit. For example, the ESD protection device maybe incorporated into a programmable logic device. The programmable logicdevice may be part of a data processing system that includes one or moreof the following components; a processor; memory; I/O circuitry; andperipheral devices. The data processing system can be used in a widevariety of applications, such as computer networking, data networking,instrumentation, video processing, digital signal processing, or anysuitable other application where the advantage of using programmable orre-programmable logic is desirable. The programmable logic device can beused to perform a variety of different logic functions. For example, theprogrammable logic device can be configured as a processor or controllerthat works in cooperation with a system processor. The programmablelogic device may also be used as an arbiter for arbitrating access to ashared resource in the data processing system. In yet another example,the programmable logic device can be configured as an interface betweena processor and one of the other components in the system.

Although the foregoing invention has been described in some detail forpurposes of clarity of understanding, it will be apparent that certainchanges and modifications may be practiced within the scope of theappended claims. Accordingly, the present embodiments are to beconsidered as illustrative and not restrictive, and the invention is notto be limited to the details given herein, but may be modified withinthe scope and equivalents of the appended claims. In the claims,elements and/or steps do not imply any particular order of operation,unless explicitly stated in the claims.

1. A method of forming a device for providing electrostatic discharge(ESD) protection, comprising: forming a source region and a drainregion, on a semiconductor substrate; forming a gate oxide on a surfaceof the semiconductor substrate between the source region and the drainregion; forming a first region having a first resistance in the drainregion; and forming a second region having a second resistance in thedrain region, wherein a first edge of the gate oxide is separated fromthe first region of the drain region, wherein a second edge of the gateoxide is in contact with the source region, and wherein the first regionis disposed below a portion of the gate oxide.
 2. The method of claim 1,wherein a resistance value of the first resistance is higher than aresistance value of the second resistance.
 3. The method of claim 1,wherein forming the first region includes, masking a portion of thedrain region; depositing cobalt in an exposed portion of the drainregion; and forming cobalt silicide in the exposed portion of the drainregion.
 4. The method of claim 1, further comprising: forming apolysilicon resistor; and coupling the polysilicon resistor to the drainregion through a metal contact.
 5. The method of claim 1, wherein aresistance value of the second resistance is at least an order ofmagnitude less than a resistance value of the first resistance.
 6. Amethod of forming a device for providing electrostatic discharge (ESD)protection, comprising: forming a source region and a drain region, on asemiconductor substrate; forming a gate oxide on a surface of thesemiconductor substrate between the source region and the drain region;forming a silicide free region having a first resistance in the drainregion; forming a silicide containing region having a second resistancein the drain region, wherein a first edge of the gate oxide is separatedfrom the first region of the drain region, and wherein a second edge ofthe gate oxide is in contact with the source region, and wherein thefirst region is disposed below a portion of the gate oxide; and couplinga polysilicon resistor to the drain region.
 7. The method of claim 6,wherein the polysilicon resistor is silicide free.
 8. The method ofclaim 6, wherein the coupling of the polysilicon resistor furthercomprises, isolating the polysilicon resistor from the semiconductorsubstrate.
 9. The method of claim 6, wherein the coupling of thepolysilicon resistor further comprises, coupling the polysiliconresistor to the silicide containing region of the drain region.
 10. Themethod of claim 6, further comprises maintaining the silicide freeregion of the drain region at a same doping concentration level as thedrain region.